Silicon Photonic Chips
Data Centre 400G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip;
Data Centre 800G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip;
Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip；
etc.
Photonic Interconnection Optical Passive Products
Passive product lines,conventional and specialised,fibre arrays and coupled optical devices are now in mass production.
Customized
Fibre-optic array customisation, integrated photonic commissioning and packaging services, etc.
Agent Products
INNOV has been acting as an agent of Albis since 2018, jointly promoting products and solutions in the Chinese market with Albis. With its professionalism and rich industry resources, Ecomicro has assisted many photovoltaic customers to successfully adopt Albis products to complete their project development.
Data Center
The bridge between data centre servers and switches is an optical module product. Optical modules are one of the indispensable products that make up a data centre, and optical chips are the core products that make up optical modules.
Data Center DCI
Data Centre Interconnection Optical Module is used for the connection between servers and switches, switches and switches, etc. It is used for data transmission and exchange. Optical Module is an indispensable part of Data Centre, and optical chip is the core product that makes up the optical module.
Photoelectric Sealing CPO
Combined Packaging Optical is the co-packaging of chips and modules by assembling the switching chip and the optical engine together in the same . The optical chip is an important part of the optical engine.
Silicon Photonic Chips
Data Centre 400G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip; Data Centre 800G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip; Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip； etc.
8*200G DR8 Silicon Photonic Chip(1.6T-DR8)
Heterogeneously integrated 8-Channel Single-Wavelength 200Gbps High-Speed Electro-Optic Modulator Chip
2*800G FR4 Silicon Photonic Chip(1.6T-DR8)
Photonic Chip with 1.6T Transmission Rate Composed of Two 4×200G-FR4 Design Structures
Heterogeneously integrated Differential Modulation Chip (800G-DR4)
Heterogeneously integrated Differential Modulation Chip (800G-DR4/1.6T-DR8)
Heterogeneously integrated Photonic Switch Chip
1*8/1*16 heterogeneously integrated Photonic Switch Chip
4*100G DR4 Silicon Photonic Chip(400G-DR4)
High-Integration Silicon Photonics Chip Solution
4*200G DR4 Silicon Photonic Chip(800G-DR4)
Heterogeneously integrated High-Speed Electro-Optic Modulator Chip
SUZHOU InnovSemi CO.,LTD