innovsemitech logo
Contact
中文
Industry Dynamics
Silicon Photonic Chips
Data Centre 800G-DR4/FR4 Heterogeneous Integration Silicon Photonics, Data Centre 1.6T-DR8/FR8 Heterogeneous Integration Silicon Photonics, Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip, etc.
Photonic Interconnection Optical Passive Products
FA-MT, MT-MT, MPO-FC, FC-FC Optical Connectivity Assemblies, PM-FA, MFD-FA, and Custom Passive Optical Products.
Customized
Fibre-optic array customisation, integrated photonic commissioning and packaging services, etc.
Agent Products
INNOV has been acting as an agent of Albis since 2018, jointly promoting products and solutions in the Chinese market with Albis. With its professionalism and rich industry resources, INNOV has assisted many photovoltaic customers to successfully adopt Albis products to complete their project development.
Data Center
The bridge between data centre servers and switches is an optical module product. Optical modules are one of the indispensable products that make up a data centre, and optical chips are the core products that make up optical modules.
Data Center DCI
Data Centre Interconnection Optical Module is used for the connection between servers and switches, switches and switches, etc. It is used for data transmission and exchange. Optical Module is an indispensable part of Data Centre, and optical chip is the core product that makes up the optical module.
Photoelectric Sealing CPO
Combined Packaging Optical is the co-packaging of chips and modules by assembling the switching chip and the optical engine together in the same . The photonic chip is an important part of the optical engine.
Collaborative research
/ What we offer / Research / Single-Lane 400 Gbps Differential Modulator Chip

Single-Lane 400 Gbps Differential Modulator Chip

Data Centre 800G-DR4/FR4 Heterogeneous Integration Silicon Photonics, Data Centre 1.6T-DR8/FR8 Heterogeneous Integration Silicon Photonics, Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip, etc.


Description：

The chip is fabricated using InnovSemi’s proprietary 8-inch wafer-scale silicon photonics heterogeneous integration platform, combining mature CMOS silicon photonics technology with thin-film lithium niobate (TFLN) through advanced die-to-wafer bonding. It achieves the complementary advantages of low-loss silicon photonics and high-performance electro-optic modulation, delivering low insertion loss, low drive voltage, and ultra-high bandwidth.

Key performance includes an electro-optic 3 dB bandwidth >110 GHz and Vπ ≈ 3 V. The differential-drive design is compatible with existing silicon photonics drivers and supports reliable, high-yield volume manufacturing.

The platform enables a smooth upgrade path from 200 Gbps/lambda (1.6T) to 400 Gbps/lambda (3.2T), helping customers accelerate product development and deployment for next-generation optical interconnects.



单波400G.png



alt

SUZHOU InnovSemi CO.,LTD

Contact Us